Start with a droplet
Some of the most intricate patterns on advanced chips begin with molten tin. In ASML’s laser-produced plasma source, a first laser pulse changes a droplet’s shape. A second, stronger pulse converts it into plasma. The plasma emits extreme ultraviolet light, or EUV, at the 13.5-nanometre wavelength used by the lithography system. It is a remarkable conversion: moving liquid metal becomes a source of light for manufacturing.
An optical system without ordinary lenses
EUV is strongly absorbed by many materials, including air. The light path therefore operates in a vacuum, and the optics use specially engineered multilayer mirrors. A patterned reflective mask, called a reticle, carries the design. The optical system projects that pattern onto a light-sensitive coating on the wafer. This is a carefully controlled exposure, not a laser carving each transistor individually.
A wavelength is not a transistor size
The headline number describes the light, not the physical size of every feature on a finished chip. Resolution also depends on numerical aperture and process choices. A commercial node name is not a direct ruler for every component. Exposing the resist is only one part of fabrication; further processing transfers patterns into structures, and repeated steps build up a complete device. Other lithography technologies still make many chip layers.
Follow the chain
Use the stage selector to trace the sequence from tin to wafer. The glowing path shows a conceptual order, not the exact arrangement or number of mirrors in a commercial machine. Think of the system as a relay: a useful source is insufficient if the optics distort the image, and perfect optics are insufficient if the wafer is misplaced. Precision comes from the entire chain working together. The interactive deliberately omits equipment settings and manufacturing recipes.
Sources & further reading
Sources checked 14 November 2026. Educational models are labelled with their assumptions. These organisations do not endorse this website.